Also called: Die Attach Operator, Assembly Operator (Semiconductor)
Runs machines that connect chips to their packages with gold or copper wires thinner than a hair.
You watch a monitor as a machine stitches hundreds of tiny wires from a chip to its frame in seconds. You check the bonds under a microscope, pull-test a few, and adjust settings when they get weak.
Estimate; based on electronic equipment assemblers.
Approximate: anchored on Bureau of Labor Statistics data for a broader job group.
High school diploma, about 0 years after high school. High school plus on-the-job training.
Ways in: On-the-job training. Training cost: Get paid while you train.
Growing faster than average. Grows with new US packaging plants.
High risk for 10 years. Wire bonders are fully automatic, with vision alignment; one person tends many machines, and many plants are offshore.
Age 18+. One way to start: Apply at chip packaging and electronics plants or through a staffing agency; new hires are trained on the job
Classes: Electronics class, Algebra.
Official data: O*NET occupation 51-2022.
Career Universe is an early version. Pay, training and AI-risk figures are estimates to start your own research, not verified facts. The research was written with AI research assistants, checked by validation scripts and spot-checked by hand. Check anything important with schools, employers and official sources. How the numbers work.